NEW DELHI, May 29 (Reuters) – U.S. chipmaker Intel and 3DGS Inc. USA will invest about $3.3 billion to set up a substrate manufacturing plant in the eastern Indian state of Odisha, the Indian government said on Friday.
Here are some details:
• The project is expected to create more than 1,800 direct high-skilled jobs.
• Substrates are the bedrock material on which elements of a semiconductor device are attached.
• New Delhi has pledged billions of dollars in subsidies to attract semiconductor plants and related manufacturing as a part of Prime Minister Narendra Modi’s wider push to build more products locally.
• The plant, planned to be set up in the Bhubaneswar-Khurda region over a period of five to six years, will focus on advanced packaging glass core substrates, high-density interconnect substrates and associated semiconductor technologies.
(Reporting by Hritam Mukherjee; Editing by Eileen Soreng)
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